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    <title>该主题</title>
    <link>https://h30471.www3.hp.com/t5/tai-shi-dian-nao/gu-tai-ying-panM-2-0xie-yi-wen-ti/m-p/1118751#M70110</link>
    <description>&lt;P&gt;hp proone 400 g5台式一体机，主版芯片为Q370，固态硬盘m2.0支持NvME4.0*4协议吗&lt;/P&gt;</description>
    <pubDate>Mon, 04 Oct 2021 11:03:45 GMT</pubDate>
    <dc:creator>东湖之美</dc:creator>
    <dc:date>2021-10-04T11:03:45Z</dc:date>
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      <title>固态硬盘M 2.0协议问题。</title>
      <link>https://h30471.www3.hp.com/t5/tai-shi-dian-nao/gu-tai-ying-panM-2-0xie-yi-wen-ti/m-p/1118751#M70110</link>
      <description>&lt;P&gt;hp proone 400 g5台式一体机，主版芯片为Q370，固态硬盘m2.0支持NvME4.0*4协议吗&lt;/P&gt;</description>
      <pubDate>Mon, 04 Oct 2021 11:03:45 GMT</pubDate>
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      <dc:creator>东湖之美</dc:creator>
      <dc:date>2021-10-04T11:03:45Z</dc:date>
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      <title>回复： 固态硬盘M 2.0协议问题。</title>
      <link>https://h30471.www3.hp.com/t5/tai-shi-dian-nao/gu-tai-ying-panM-2-0xie-yi-wen-ti/m-p/1119174#M70124</link>
      <description>&lt;P&gt;Q370是PCIe 3.0&lt;/P&gt;</description>
      <pubDate>Thu, 07 Oct 2021 03:35:16 GMT</pubDate>
      <guid>https://h30471.www3.hp.com/t5/tai-shi-dian-nao/gu-tai-ying-panM-2-0xie-yi-wen-ti/m-p/1119174#M70124</guid>
      <dc:creator>y2kim</dc:creator>
      <dc:date>2021-10-07T03:35:16Z</dc:date>
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